7M2U image
Deposition Date 2021-03-17
Release Date 2021-07-28
Last Version Date 2025-05-14
Entry Detail
PDB ID:
7M2U
Title:
Nucleotide Excision Repair complex TFIIH Rad4-33
Biological Source:
Method Details:
Experimental Method:
Resolution:
8.20 Å
Aggregation State:
PARTICLE
Reconstruction Method:
SINGLE PARTICLE
Macromolecular Entities
Polymer Type:polypeptide(L)
Molecule:DNA repair helicase RAD3
Gene (Uniprot):RAD3
Chain IDs:E (auth: 0)
Chain Length:778
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:General transcription and DNA repair factor IIH subunit TFB1
Gene (Uniprot):TFB1
Chain IDs:F (auth: 1)
Chain Length:642
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:General transcription and DNA repair factor IIH subunit TFB2
Gene (Uniprot):TFB2
Chain IDs:K (auth: 2)
Chain Length:513
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:General transcription and DNA repair factor IIH subunit TFB4
Gene (Uniprot):TFB4
Chain IDs:G (auth: 4)
Chain Length:338
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:General transcription and DNA repair factor IIH subunit TFB5
Gene (Uniprot):TFB5
Chain IDs:D (auth: 5)
Chain Length:66
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:General transcription and DNA repair factor IIH subunit SSL1
Gene (Uniprot):SSL1
Chain IDs:H (auth: 6)
Chain Length:461
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:DNA repair helicase RAD25
Gene (Uniprot):SSL2
Chain IDs:A (auth: 7)
Chain Length:843
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:DNA repair protein RAD4
Gene (Uniprot):RAD4
Chain IDs:I (auth: A)
Chain Length:754
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polypeptide(L)
Molecule:DNA repair protein RAD33
Gene (Uniprot):RAD33
Chain IDs:J (auth: E)
Chain Length:177
Number of Molecules:1
Biological Source:Saccharomyces cerevisiae (strain ATCC 204508 / S288c)
Polymer Type:polydeoxyribonucleotide
Molecule:Damaged DNA strand
Chain IDs:C (auth: W)
Chain Length:14
Number of Molecules:1
Biological Source:synthetic construct
Polymer Type:polydeoxyribonucleotide
Molecule:Undamaged DNA strand
Chain IDs:B (auth: Y)
Chain Length:10
Number of Molecules:1
Biological Source:synthetic construct
Primary Citation
Cryo-EM structure of TFIIH/Rad4-Rad23-Rad33 in damaged DNA opening in nucleotide excision repair.
Nat Commun 12 3338 3338 (2021)
PMID: 34099686 DOI: 10.1038/s41467-021-23684-x

Abstact

The versatile nucleotide excision repair (NER) pathway initiates as the XPC-RAD23B-CETN2 complex first recognizes DNA lesions from the genomic DNA and recruits the general transcription factor complex, TFIIH, for subsequent lesion verification. Here, we present a cryo-EM structure of an NER initiation complex containing Rad4-Rad23-Rad33 (yeast homologue of XPC-RAD23B-CETN2) and 7-subunit coreTFIIH assembled on a carcinogen-DNA adduct lesion at 3.9-9.2 Å resolution. A ~30-bp DNA duplex could be mapped as it straddles between Rad4 and the Ssl2 (XPB) subunit of TFIIH on the 3' and 5' side of the lesion, respectively. The simultaneous binding with Rad4 and TFIIH was permitted by an unwinding of DNA at the lesion. Translocation coupled with torque generation by Ssl2 and Rad4 would extend the DNA unwinding at the lesion and deliver the damaged strand to Rad3 (XPD) in an open form suitable for subsequent lesion scanning and verification.

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Primary Citation of related structures