1X6W image
Deposition Date 2004-08-12
Release Date 2004-10-05
Last Version Date 2024-05-22
Entry Detail
PDB ID:
1X6W
Keywords:
Title:
Solution Structure of the DNA Duplex TGCGCA:TGCGCA Capped by Trimethoxystilbene Residues
Biological Source:
Source Organism:
Method Details:
Experimental Method:
Conformers Submitted:
2
Selection Criteria:
structures with the lowest energy
Macromolecular Entities
Polymer Type:polydeoxyribonucleotide
Molecule:5'-D(*(TMS)P*TP*GP*CP*GP*CP*A)-3'
Chain IDs:A, B
Chain Length:7
Number of Molecules:2
Biological Source:
Ligand Molecules
Primary Citation
How much pi-stacking do DNA termini seek? Solution structure of a self-complementary DNA hexamer with trimethoxystilbenes capping the terminal base pairs.
Biochemistry 43 15680 15687 (2004)
PMID: 15595824 DOI: 10.1021/bi048205y

Abstact

The exposed terminal base pairs of DNA duplexes are nonclassical binding sites for small molecules. Instead, small molecules usually prefer intercalation or minor groove binding. Here we report the solution structure of the DNA duplex (TMS-TGCGCA)(2), where TMS denotes trimethoxystilbene carboxamides that are 5'-tethered to the DNA. The stilbenes, for which intercalation is conformationally accessible, stack on the terminal T:A base pairs of an undisturbed B-form duplex. Two conformations, differing by the orientation of the stilbene relative to the terminal base pair, are observed, indicating that the flip rate is slow for the pi-stacked aromatic ring system. The trimethoxystilbene is known to greatly increase base pairing fidelity at the terminus. Here we show that it gauges the size of the T:A base pair by embracing the 2'-methylene group of the terminal dA residue of the unmodified terminus with its methoxy "arms", but that it does not engage the entire base pair in pi-stacking. Mismatched base pairs with their altered geometry will not allow for the same embracing interaction. On the basis of the current structure, a trimethoxychrysene carboxamide is proposed as a ligand with increased pi-stacking surface and possible applications as improved fidelity-enhancing element.

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